86-18925211445
取消

TC3-3.5G

Part number TC3-3.5G
Product classification Adhesives, Epoxies, Greases, Pastes
Manufacturer Chip Quik, Inc.
Description HEAT SINK THERMAL COMPOUND
Encapsulation
Packing Bulk
Quantity 59
RoHS status YES
Share
Inventory:
Total number

Quantity

Price

Total price

1

$15.6975

$15.6975

Obtain quotation information
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrChip Quik, Inc.
SeriesCHIPQUIK®
PackageBulk
Product StatusACTIVE
ColorGray
Size / Dimension3.5 gram Syringe
TypeSilicone Compound
Thermal Conductivity8.50W/m-K
Storage/Refrigeration Temperature37°F ~ 77°F (3°C ~ 25°C)
Shelf Life StartDate of Manufacture
Shelf Life60 Months
Usable Temperature Range-40°F ~ 302°F (-40°C ~ 150°C)

Panasonic Electronic Components
RES SMD 1.1K OHM 5% 1/8W 0805
Panasonic Electronic Components
RES SMD 2.4K OHM 5% 1/8W 0805
Panasonic Electronic Components
RES SMD 1.5K OHM 5% 1/8W 0805
Panasonic Electronic Components
RES SMD 3K OHM 5% 1/8W 0805
Panasonic Electronic Components
RES 68 OHM 5% 3W AXIAL
Panasonic Electronic Components
RES 560 OHM 5% 3W AXIAL
Panasonic Electronic Components
RES 5.1K OHM 5% 3W AXIAL
Panasonic Electronic Components
RES 43K OHM 5% 3W AXIAL
Panasonic Electronic Components
RES 47K OHM 5% 1W AXIAL
Panasonic Electronic Components
RES 680 OHM 5% 2W AXIAL
关闭
Inquiry
captcha

86-18925211445
0